Mechanical Design Engineer - Siemens NX - FEA - Electronic Packaging
A position has arisen for a Lead Mechanical Engineer - Structural Analyst the position is required to meet increased demand for support on existing and new projects. The team is responsible for mechanical design of electronic equipment for civil and military applications. In this role you will provide mechanical design/engineering leadership and structural analysis.
The ideal candidate will have experience of designing mechanical housing around electronics e.g. Electronic Packaging or Electronic Enclosures
The Lead Mechanical Design Engineer - ANSYS will demonstrate leadership in communicating business goals, programs and processes for mechanical engineering, you will utilise your experience and expertise to solve problems develop, and execute objectives. You will conduct structural analysis on electronic enclosures for aerospace applications using sound engineering principles and adhering to business standards processes and program requirements. You will manage with your team the creation of technical data generated for assigned projects and tasks consistent with engineering policies and procedures, e.g. part and assembly drawings, parts list, weight management plans, tolerance analysis, definition of materials and finishes.
Key skills & responsibilities:
Bachelor of Science in Mechanical Engineering or similar project with relevant experience in engineering analysis
Conduct structural analysis on electronic enclosures for aerospace applications
Provide technical leadership to other engineers and designers
Experience in conducting structural analysis of lightweight structures
Experience with ANSYS or another structural analysis tool
To define any engineering tests deemed necessary to de-risk a design and provide engineering support